This paper presents a novel on-chip microelectromechanical system (MEMS) that may notice in-situ quantitative mechanical testing of nanostructures underneath tension-compression features. The machine integrates stress and compression electrostatic actuators with reverse driving orientations in a assist system, enabling environment friendly measurement discount whereas retaining actuation capabilities. Mechanical properties of three sorts of nanostructures fabricated utilizing centered ion beam (FIB) methods have been investigated with the introduced on-chip testing system. Outcomes declare that Pt nanopillars and C nanowires seem plastic deformation habits underneath stress take a look at, with common Younger’s moduli of 70.06 GPa and 58.32 GPa, respectively. Within the compression take a look at, the Pt nanopillar exhibited in-plane buckling habits with a yield energy of 912 MPa and Younger’s modulus of 68.81 GPa. The C nanowire displayed 3D twisting habits with a most pressure of 25.47%, indicating distinctive flexibility. Furthermore, the uneven habits of the C nanospring is revealed throughout 5 loading-unloading tension-compression deformation exams. This on-chip MEMS machine gives a promising answer for mechanical testing of nanostructures, with potential purposes in nanotechnology analysis.